On Saturday 10 May 2008 12:17, Chuck Guzis wrote:
> > Date: Fri, 9 May 2008 10:59:35 -0700 (PDT)
> > From: "Eric Smith"
> >
> > The lead pitch of shrink DIP packages is 0.070
inch (1.78 mm). I
> > haven't seen any 0.050 (1.27 mm) inch DIPs.
Shrink DIPs were popular
> > with Japanese semi companies, but never caught on
very well with US
> > companies, most of which skipped those and went
straight to PLCC and
> > PQFP packages.
>
> Right you are--I dug out a couple of shrink DIPs and
they are indeed
> 0.070 inch. Unless you're going right to PCB, these
are a real pain
> to deal with today--hard to find sockets, odd spacing,
etc. I think
> I've still got a couple of 64180s in this package
kicking around
> somewhere.
>
> Thanks for the correction.
I haven't measured them but I do have about four or so
HD6303Y (Hitachi CMOS
68xx variant with bunches of built-in peripheral stuff)
that's in a package
like that. I managed to score *one* socket of the wire-wrap
variety as a
sample at some trade show I was at years ago, but am not
100% sure that it's
standard 0.025" wrap posts, in which case I'm still
screwed on being able to
do anything with them.
--
Member of the toughest, meanest, deadliest, most unrelenting
-- and
ablest -- form of life in this section of space, a critter
that can
be killed but can't be tamed. --Robert A. Heinlein,
"The Puppet Masters"
-
Information is more dangerous than cannon to a society ruled
by lies. --James
M Dakin
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