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CALL FOR
PAPERS
IEEE SECON
2006
Third Annual IEEE Communications
Society Conference on
Sensor, Mesh and Ad Hoc
Communications and Networks
Hyatt Regency, Reston,
VA, USA
September 25-28,
2006
Paper submissions due
(via EDAS):
* Extended to: * April 6, 2006
(Abstract/title registration)
* Extended to: * April 12, 2006 (Full
paper)
http://www.
ieee-secon.org/2006/index.html
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The third annual IEEE SECON conference will provide a unique
forum to
exchange ideas, techniques, and applications, discuss best
practices,
raise awareness, and share experiences among researchers,
practitioners, standard developers and policy makers in the
field of
sensor, ad hoc, and mesh networks and systems. IEEE SECON
grew out of
IEEE INFOCOM (http://www.ieee-infocom.o
rg) in 2004, in order to create
an event that focused on the important and exciting topics
of Sensor,
Mesh and Ad Hoc Communications and Networks.
The conference will be organized to provide for collegiality
and
continuity in the discussions of the various topics among
participants
from the industrial, governmental and academic sectors.
Original technical papers that address the communications,
networking,
applications, systems and algorithmic aspects of mesh and
sensor
networks, as well as those that describe practical
deployment and
implementation experiences are solicited for presentation at
the
conference and publication in the conference proceedings.
Papers
presenting novel contributions in such disciplines as
communications,
networking protocols and architectures, algorithms, embedded
systems,
middleware and information management, and novel
applications are
solicited.
PAPERS:
Full papers - describing original, previously unpublished
research
work, experimental efforts, practical experiences, and
industrial and
commercial developments in sensor, ad hoc, and mesh
communications and
networks - are solicited. Papers with a deep focus on a
specific
discipline or stimulated by the synergistic interaction of
diverse
disciplines are encouraged. Papers describing practical
application
of technology to real-world problems are similarly
encouraged. Papers
submitted should not be concurrently under review at another
conference, journal or similar venue.
Particular topics of interest include, but are not limited
to:
* New architectures and protocols to support communication,
localization, time synchronization, routing, data
dissemination, and
other distributed services in heterogeneous, large-scale
distributed,
mesh networks and sensor networks
* Novel algorithms and theories for management, supervisory
control,
and monitoring of distributed ad hoc networks, and
techniques for the
interpretation and use of sensor data in decision-making
processes
* Modeling and performance evaluation of large-scale
distributed ad
hoc and sensor networks, practical implementations and
deployments,
and real-world experiences
* Theories and models on fundamental information and
communication
aspects of wireless mesh and sensor networks
* Mechanisms for authenticated, secure communication and
data
dissemination in sensor and mesh networks
* Algorithms and protocols to support quality of service in
mesh and
sensor networks, including admission control, resource
allocation and
fairness, and capacity planning
* Integration of sensors into engineered systems, including
novel
techniques for on-sensor renewable power sources, mechanisms
for
on-sensor self-calibration and self-testing, and efficient
schemes to
maximize accuracy and minimize false alarms
* Hardware platforms incorporating multiple sensors,
computation,
actuation, and wireless interfaces
* Software platforms, middleware, and tools for mesh and
sensor
network applications development, deployment, and management
PANELS:
Proposals for panels on current topics in the field of
ad hoc and sensor networking and applications are solicited.
Panels
related to the commercial application and development of
sensors and
mesh networks are especially encouraged.
POSTERS, DEMOS AND EXPO:
IEEE SECON 2006 will include poster/demonstration
sessions that
shall provide a forum to present and discuss: works in
progress,
industry demonstrations of new applications and
techniques,
practical implementations, industrial and commercial
developments,
research testbeds and demonstrations, recent
research/implementation results, upcoming research
challenges,
future directions, and novel approaches in the fields of
sensor,
mesh and ad hoc communications and networks. One of the
key goals
of this conference is to foster collaboration between
industry and
academia. Hence, participation of researchers/developers
from
industry and posters/demostrations reporting joint work
between
industry and academia are especially encouraged.
Submissions should be in the form of a proposal
describing the
main contributions of the poster/demo and the merits of
the
proposed ideas. If available, preliminary results can
also be
included. Proposals will be evaluated mainly based on
their
potential to stimulate interesting discussions, exchange
of ideas
and promote collaborations.
Submissions should not be more than three pages
(preferably IEEE
conference format, 2-column) in length. Demonstration
submissions
should include the space requirements and/or any other
equipment-specific requirements. The documents must
contain the
authors' names, affiliations, and contact information
and the
designated corresponding author.
Accepted authors of posters/demos will have a space in
the
poster/demo session room to display their posters or
exhibit their
demos and describe their work in discussions with
interested
attendees.
SUBMISSION INSTRUCTIONS:
All paper submissions will be handled electronically through
the EDAS
system. Details regarding the paper format and the
submission process
can be found at http://www
.ieee-secon.org/2006/index.html.
Accepted papers will be published in the conference
proceedings and
will appear on IEEE Xplore. IEEE Communications Society
policy states
that all accepted SECON 2006 papers must have at least one
registration at the regular rate. For authors co-authoring
multiple
papers, one regular registration is valid for up to three
papers.
IMPORTANT DATES:
Paper registration: April 6, 2006, by 5pm EDT
Full Paper Submission: April 12, 2006, by 5pm EDT
Decision Notification: June 15, 2006, by 5pm EDT
Camera-ready paper due: July 7, 2006, by 5pm EDT
Panel proposals due: May 1, 2006, by 5pm EDT
Demo proposals due: June 1, 2006, by 5pm EDT
Poster proposals due: June 30, 2006, by 5pm EDT
CONFERENCE ORGANIZING
COMMITEE
GENERAL CHAIR:
Krishna Sivalingam, University of Maryland Baltimore County,
krishna umbc.edu
TECHNICAL PROGRAM CO-CHAIRS:
Mark Yarvis, Intel Corporation, mark.d.yarvisintel.com
Michele Zorzi, Universita' degli Studi di Padova, zorzidei.unipd.it
POSTERS/DEMOS CO-CHAIRS:
Stefano Basagni, Northeastern University, basagniece.neu.edu
Cedric Westphal, Nokia, Cedric.Westphalnokia.com
PANELS CO-CHAIRS:
Ian Chakeres, Boeing, ian.chakeresgmail.com
Lily Yang, Intel, lily.l.yangintel.com
WORKSHOPS CHAIR:
Tom Hou, Virginia Tech, thouvt.edu
PUBLICITY CHAIR:
Wendi Heinzelman, University of Rochester, wheinzelece.rochester.edu
EXHIBITS/SPONSORSHIPS CHAIR:
Vishal Anand, SUNY Brockport, vanandbrockport.edu
LOCAL ARRANGEMENTS CHAIR:
Mohamed Eltoweissy, Virgina Tech, toweissyvt.edu
STANDING COMMITTEE:
Fred Bauer (fredfredbauer.com), PacketHop (CHAIR)
Harvey Freeman, Booz Allen Hamilton
Sung-Ju Lee, HP Labs
Prasant Mohapatra, University of California, Davis
TECHNICAL PROGRAM COMMITTEE
Abouzeid, Alhussein (Hussein) Rensselaer Polytechnic
Institute
Almeroth, Kevin University of California at Santa Barbara
Banerjee, Sujata HP Labs
Banerjee, Suman University of Wisconsin
Basagni, Stefano Northeastern University
Belding-Royer, Elizabeth University of California Santa
Barbara
Bianchi, Giuseppe University of Rome, Tor Vergata
Boutaba, Raouf University of Waterloo
Cao, Guohong Pennsylvania State University
Cayirci, Erdal Istanbul Technical University
Chandra, Surendar University of Notre Dame
Chevillat, Pierre IBM
Choi, Sunghyun Seoul National Unversity
Chuah, Chen-Nee University of California, Davis
Das, Sajal University of Texas at Arlington
Das, Samir SUNY at Stony Brook
ElBatt, Tamer HRL Laboratories
Ekici, Eylem Ohio State
Ephremides, Anthony University of Maryland at College Park
Garcia-Luna-Aceves, J.J. University of California at Santa
Cruz
Giordano, Silvia SUPSI of Lugano
Hares, Susan NextHop
Havinga, Paul University of Twente
Helmy, Ahmed USC
Iyer, Sridhar Indian Institute of Technology
Jetcheva, Jorjeta Firetide, Inc.
Jha, Sanjay University of NSW
Joshi, Anupam UMBC
Kangude, Shantanu Texas Instruments
Kasera, Sneha University of Utah
Ko, Young-Bae Ajou University
Koodli, Rajeev Nokia Research Center
Krishnamachari, Bhaskar University of Southern California
Krishnamurthy, Lakshman Intel Corp
Langendoen, Koen Delft University of Technology
Lee, Sung-Ju HP Labs
Li, Li Bell Labs, Lucent Technologies
Martin, Richard Rutgers University
Mohapatra, Prasant University of California, Davis
Morabito, Giacomo University of Catania, Italy
Nandagopal, Thyaga Bell Labs, Lucent Technologies
Ning, Peng North Carolina State University
Pagani, Elena University of Milano
Papagiannaki, Konstantina (Dina) Intel Research
Petrioli, Chiara University of Rome, la Sapienza
Popovski, Petar Aalborg University
Qiu, Lili University of Texas at Austin
Ramasubramanian, Srini Unviersity of Arizona
Ramasubramanian, Venugopalan "Rama" Microsoft
Research
Reisslein, Martin Arizona State University
Rhee, Sokwoo Millennial Net
Roemer, Kay ETH Zurich (Swiss Federal Institute of
Technology)
Santi, Paolo CNR
Schurgers, Curt University of California, San Diego
Shorey, Rajeev General Motors Research, Bangalore
Singh, Harkirat Samsung
Singh, Suresh Portland State University
Srinivasan, Vikram NU of Singapore
Stankovic, John University of Virginia
Trappe, Wade Rutgers University
Tseng, Yu-Chee National Chiao-Tung University
Wang, Xudong Kiyon, Inc
Westphal, Cedric Nokia Research Center
Widmer, Joerg DoCoMo
Zhang, Junshan Arizona State University
Zhang, Qian Hong Kong University of Science and Technology
Zheng, Haitao (Heather) University of CA, Santa Barbara
Znati, Taieb University of Pittsburgh
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